Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10486963 | Wafer-level package with enhanced performance | Jonathan Hale Hammond, Jon Chadwick, Julio C. Costa, Jan Edward Vandemeer | 2019-11-26 |
| 10490471 | Wafer-level packaging for enhanced performance | Julio C. Costa, Peter V. Wright, Jon Chadwick | 2019-11-26 |
| 10262915 | Thermally enhanced semiconductor package with thermal additive and process for making the same | Julio C. Costa, George Maxim, Dirk Robert Walter Leipold, Baker Scott, Stephen Mobley | 2019-04-16 |