Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10438877 | Multi-chip packages with stabilized die pads | Jose Felixminia PALAGUD, JR. | 2019-10-08 |
| 10283466 | Polymer resin and compression mold chip scale package | Yusheng LIN, Chee Hiong CHEW, Francis J. Carney | 2019-05-07 |
| 10199311 | Leadless semiconductor packages, leadframes therefor, and methods of making | Darrell D. Truhitte, Chee Hiong CHEW | 2019-02-05 |
| 10177074 | Flexible semiconductor package | Atapol Prajuckamol, Hoe Kit Liew How Kat Ley | 2019-01-08 |