Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453764 | Molding for large panel fan-out package | Po-Wei LU, Ming Tsung Shen, Yu-Tzu Peng | 2019-10-22 |
| 10211161 | Semiconductor package structure having a protection layer | Yuan-Feng Chiang, Cong Chen, I-Ting Chi | 2019-02-19 |