Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10344383 | Semiconductor package device and method of manufacturing the same | Chuan-Yung Shih, Tai-Yuan Huang, Yu-Chi Wang, Chin-Feng Wang, Sing-Syuan Shiau +3 more | 2019-07-09 |
| 10325854 | Interposer and semiconductor package device | Kun-Ming Chen | 2019-06-18 |
| 10211161 | Semiconductor package structure having a protection layer | Cong Chen, I-Ting Chi, Shao-An Chen | 2019-02-19 |