Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10438863 | Chip package assembly with surface mounted component protection | Inderjit Singh | 2019-10-08 |
| 10219387 | Process for manufacturing a printed circuit board having high density microvias formed in a thick substrate | Leilei Zhang, Abraham Yee, Zuhair Bokharey | 2019-02-26 |