Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE47600 | Semiconductor device and method of forming electrical interconnect with stress relief void | — | 2019-09-10 |
| 10388612 | Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits | Yaojian Lin, Byung Joon Han, Il Kwon Shim, Pandi C. Marimuthu, Won Kyoung Choi +1 more | 2019-08-20 |
| 10388626 | Semiconductor device and method of forming flipchip interconnect structure | — | 2019-08-20 |