Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446504 | Chip package and method for forming the same | Chia-Ming Cheng, Wei-Chung Yang, Kuan-Jung Wu, Shu-Ming Chang | 2019-10-15 |
| 10424540 | Chip package and method for forming the same | Yen-Shih Ho, Chia-Ming Cheng, Hsin-Yen Lin | 2019-09-24 |