Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461117 | Semiconductor structure and method for manufacturing semiconductor structure | Tsang-Yu Liu, Chia-Sheng Lin, Chaung-Lin LAI | 2019-10-29 |
| 10424540 | Chip package and method for forming the same | Po-Han Lee, Chia-Ming Cheng, Hsin-Yen Lin | 2019-09-24 |
| 10388541 | Wafer coating system and method of manufacturing chip package | Yu-Tung Chen, Quan Su, Chuan-Jin Shiu, Chien-Hui Chen, Hsiao-Lan Yeh | 2019-08-20 |
| 10318784 | Touch panel-sensing chip package module complex and a manufacturing method thereof | Shu-Ming Chang, Tsang-Yu Liu | 2019-06-11 |