Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446504 | Chip package and method for forming the same | Chia-Ming Cheng, Po-Han Lee, Wei-Chung Yang, Kuan-Jung Wu | 2019-10-15 |
| 10318784 | Touch panel-sensing chip package module complex and a manufacturing method thereof | Tsang-Yu Liu, Yen-Shih Ho | 2019-06-11 |