Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10319688 | Antenna on ceramics for a packaged die | Andreas Wolter, Saravana Maruthamuthu, Mikael Bergholz Knudsen, Thorsten Meyer, Georg Seidemann +1 more | 2019-06-11 |
| 10249598 | Integrated circuit package having wirebonded multi-die stack | Thorsten Meyer, Richard Patten | 2019-04-02 |