Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D864119 | Electrical connector | — | 2019-10-22 |
| 10196513 | Epoxy resin composition, semiconductor sealing agent, and semiconductor device | Tomoya YAMAZAWA, Kazuyuki Kohara, Kodai Okoshi | 2019-02-05 |