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Tomoya YAMAZAWA

NA Namics: 1 patents #4 of 27Top 15%
Overall (2019): #236,709 of 560,194Top 45%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10196513 Epoxy resin composition, semiconductor sealing agent, and semiconductor device Kazuyuki Kohara, Kodai Okoshi, Nobuyuki Abe 2019-02-05