Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10196513 | Epoxy resin composition, semiconductor sealing agent, and semiconductor device | Tomoya YAMAZAWA, Kodai Okoshi, Nobuyuki Abe | 2019-02-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10196513 | Epoxy resin composition, semiconductor sealing agent, and semiconductor device | Tomoya YAMAZAWA, Kodai Okoshi, Nobuyuki Abe | 2019-02-05 |