Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10424559 | Thermal management of molded packages | Feras Eid, Johanna M. Swan, Taesha D. Beasley, Sasha N. Oster, Tannaz Harirchian +1 more | 2019-09-24 |
| 10281521 | System for thermal management of device under test (DUT) | David W. Song, James Hastings, Akhilesh Rallabandi, Morten S. Jensen, Christopher Wade Ackerman +2 more | 2019-05-07 |
| 10261121 | Diamond-like carbon coated semiconductor equipment | Jelena Culic-Viskota | 2019-04-16 |
| 10228418 | Alignment fixtures for an integrated circuit packages | Sruti Chigullapalli, Rene J. Sanchez, Todd Coons, Tuan Hoong Goh | 2019-03-12 |