Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10361173 | Semiconductor package assemblies with system-on-chip (SOC) packages | Tzu-Hung Lin | 2019-07-23 |
| 10332830 | Semiconductor package assembly | Wei-Che Huang, Tzu-Hung Lin | 2019-06-25 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10361173 | Semiconductor package assemblies with system-on-chip (SOC) packages | Tzu-Hung Lin | 2019-07-23 |
| 10332830 | Semiconductor package assembly | Wei-Che Huang, Tzu-Hung Lin | 2019-06-25 |