Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10440819 | Fan-out wafer level packages having preformed embedded ground plane connections | — | 2019-10-08 |
| 10388607 | Microelectronic devices with multi-layer package surface conductors and methods of their fabrication | Zhiwei Gong, Scott M. Hayes | 2019-08-20 |
| 10381295 | Lead frame having redistribution layer | Ryan Hooper, Dwight L. Daniels | 2019-08-13 |
| 10354958 | Through package circuit in fan-out wafer level package | — | 2019-07-16 |
| 10236260 | Shielded package with integrated antenna | Gregory J. Durnan | 2019-03-19 |