Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10395940 | Method of etching microelectronic mechanical system features in a silicon wafer | Feng Zhou, Ki Wook Jung, Ercan Mehmet Dede, Mehdi Asheghi | 2019-08-27 |
| 10180288 | High-conductivity bonding of metal nanowire arrays | John A. Starkovich, Edward M. Silverman, Jesse B. Tice, Hsiao-Hu Peng, Michael T. Barako | 2019-01-15 |