Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10211497 | 3D RF-substrate patterning | Jimmy Georges Donald Hester, Evan P. Nguyen, Vesna Radisic, Andrew D. Smith | 2019-02-19 |
| 10180288 | High-conductivity bonding of metal nanowire arrays | John A. Starkovich, Edward M. Silverman, Hsiao-Hu Peng, Michael T. Barako, Kenneth E. Goodson | 2019-01-15 |
| 10182493 | Alloy bonded graphene sheets for enhanced thermal spreaders | John A. Starkovich, Xianglin ZENG, Andrew D. Kostelec, Hsiao-Hu Peng, Edward M. Silverman | 2019-01-15 |