Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10445278 | Interface bridge between integrated circuit die | Jeffrey Erik Schulz, David W. Mendel, Dinesh Patil, Gary Brian Wallichs, Jakob Raymond Jones | 2019-10-15 |
| 10439639 | Seemingly monolithic interface between separate integrated circuit die | David W. Mendel, Jeffrey Erik Schulz, Huy Ngo, Jakob Raymond Jones | 2019-10-08 |
| 10404627 | Multi-function, multi-protocol FIFO for high-speed communication | Huy Ngo, Vinson Chan, Divya Vijayaraghavan, Curt Wortman | 2019-09-03 |
| 10394737 | Multichip package with protocol-configurable data paths | Huy Ngo, David W. Mendel | 2019-08-27 |
| 10348311 | Apparatus for improving power consumption of communication circuitry and associated methods | Curt Wortman, Michael Zheng | 2019-07-09 |