Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10224272 | Semiconductor package including a rewiring layer with an embedded chip | Ji Hwang Kim, Cha-Jea Jo, Won-Il Lee | 2019-03-05 |
| 10199319 | Printed circuit board and semiconductor package including the same | Sang-Uk Han, Yun-Seok Choi, Ji Hwang Kim | 2019-02-05 |