Issued Patents 2019
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475810 | Conductive components and memory assemblies | Sudip Bandyopadhyay, Keen Wah Chow, Devesh Kumar Datta, Anurag Jindal, David Ross Economy | 2019-11-12 |
| 10446727 | Ohmic contacts for semiconductor structures | Yongjun Jeff Hu, Shanming Mou, Everett A. McTeer | 2019-10-15 |
| 10424596 | Conductive structures and assemblies having vertically-stacked memory cells over conductive structures | Nancy M. Lomeli, Tom George, Jordan D. Greenlee, Scott M. Pook | 2019-09-24 |
| 10361214 | Methods of filling openings with conductive material, and assemblies having vertically-stacked conductive structures | Jordan D. Greenlee, Everett A. McTeer | 2019-07-23 |
| 10361216 | Methods used in forming an array of elevationally-extending transistors | Jordan D. Greenlee, E. Allen McTeer | 2019-07-23 |
| 10355014 | Assemblies having vertically-extending structures | David Ross Economy, Haoyu Li, Yongjun Jeff Hu, Christopher W. Petz, Daniel Billingsley +1 more | 2019-07-16 |
| 10354989 | Integrated assemblies and methods of forming integrated assemblies | Daniel Billingsley, Everett A. McTeer, Christopher W. Petz, Haoyu Li, Yongjun Jeff Hu | 2019-07-16 |
| 10344398 | Source material for electronic device applications | Yushi Hu, Yongjun Jeff Hu, Everett A. McTeer | 2019-07-09 |
| 10304749 | Method and apparatus for improved etch stop layer or hard mask layer of a memory device | Christopher W. Petz, Philip M. Campbell, Wei Yeeng Ng, Kunal Shrotri, Saurabh Keshav +2 more | 2019-05-28 |
| 10283524 | Methods of filling horizontally-extending openings of integrated assemblies | Jordan D. Greenlee, Chet E. Carter, Collin Howder, Everett A. McTeer | 2019-05-07 |
| 10217936 | Apparatuses including electrodes having a conductive barrier material and methods of forming same | Swapnil Lengade, Andrea Gotti | 2019-02-26 |
| 10170493 | Assemblies having vertically-stacked conductive structures | Jordan D. Greenlee, Everett A. McTeer | 2019-01-01 |