Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510737 | Semiconductor package | Chajea Jo, Sang-Uk Han, Kyoung Soon Cho, Jae Choon Kim, Woohyun Park | 2019-12-17 |
| 10347611 | Semiconductor packages having redistribution substrate | Jae Choon Kim, Hansung Ryu, KyongSoon Cho, Youngsang Cho, Yeo-Hoon Yoon | 2019-07-09 |
| 10198049 | Surface temperature management method of mobile device and memory thermal management method of multichip package | Heungkyu Kwon, Jae Choon Kim, Eunseok Cho | 2019-02-05 |