Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347611 | Semiconductor packages having redistribution substrate | Jichul Kim, Jae Choon Kim, KyongSoon Cho, Youngsang Cho, Yeo-Hoon Yoon | 2019-07-09 |
| 10211070 | Semiconductor device and method for manufacturing the same | Chanho Lee, Hyunsoo Chung, Inyoung Lee | 2019-02-19 |