Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10460956 | Interposer with lattice construction and embedded conductive metal structures | Benjamin V. Fasano, Shidong Li | 2019-10-29 |
| 10423751 | Semiconductor package floating metal checks | Franklin M. Baez, Jason L. Frankel, Paul R. Walling | 2019-09-24 |
| 10224273 | Multi terminal capacitor within input output path of semiconductor package interconnect | Charles L. Arvin, Brian W. Quinlan, Charles L. Reynolds, Brian R. Sundlof | 2019-03-05 |
| 10224274 | Multi terminal capacitor within input output path of semiconductor package interconnect | Charles L. Arvin, Brian W. Quinlan, Charles L. Reynolds, Brian R. Sundlof | 2019-03-05 |
| 10211174 | Flip chip assembly with connected component | Luc Guerin, Richard Langlois, Stephan L. Martel, Sylvain E. Ouimet | 2019-02-19 |