Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510575 | Substrate support with multiple embedded electrodes | Philip Allan Kraus, Thai Cheng Chua | 2019-12-17 |
| 10504765 | Electrostatic chuck assembly having a dielectric filler | Kartik Ramaswamy, Anwar Husain, Haitao Wang, Evans Lee, Hamid Noorbakhsh +3 more | 2019-12-10 |