Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10170337 | Implant after through-silicon via (TSV) etch to getter mobile ions | Christopher N. Collins, Mukta G. Farooq, Troy L. Graves-Abe, Brian J. Greene, Robert Hannon +1 more | 2019-01-01 |