Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10319652 | Semiconductor package with elastic coupler and related methods | Yusheng LIN, Francis J. Carney | 2019-06-11 |
| 10283466 | Polymer resin and compression mold chip scale package | Yusheng LIN, Soon Wei WANG, Francis J. Carney | 2019-05-07 |
| 10231340 | Single reflow power pin connections | Yushuang YAO, Atapol Prajuckamol, Francis J. Carney, Yusheng LIN | 2019-03-12 |
| 10224655 | Flexible press fit pins for semiconductor packages and related methods | Yushuang YAO, Atapol Prajuckamol | 2019-03-05 |
| 10199311 | Leadless semiconductor packages, leadframes therefor, and methods of making | Darrell D. Truhitte, Soon Wei WANG | 2019-02-05 |