Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446455 | Fingerprint sensor and manufacturing method thereof | Sung-Sun Park, Ji Young Chung | 2019-10-15 |
| 10297515 | Fingerprint sensor and manufacturing method thereof | Sung-Sun Park, Ji Young Chung | 2019-05-21 |
| 10242966 | Thin bonded interposer package | Roger D. St. Amand, Jin Seong Kim | 2019-03-26 |