Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10424531 | Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulant | Xiao Li, Jaspreet S. Gandhi | 2019-09-24 |
BB
Bradley R. Bitz
Overall (2019): #526,128 of 560,194Top 95%
1
Patents 2019