Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10276545 | Semiconductor package and manufacturing method thereof | Kun-Yung Huang, Chi-Liang Pan, Jing CHENG | 2019-04-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10276545 | Semiconductor package and manufacturing method thereof | Kun-Yung Huang, Chi-Liang Pan, Jing CHENG | 2019-04-30 |