Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10460959 | Package structure and manufacturing method thereof | Yen-Ju Chen | 2019-10-29 |
| 10276545 | Semiconductor package and manufacturing method thereof | Chi-Liang Pan, Jing CHENG, Bin-Hui Tseng | 2019-04-30 |
| 10177058 | Encapsulating composition, semiconductor package and manufacturing method thereof | Ming-Yi Wang | 2019-01-08 |