Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10276545 | Semiconductor package and manufacturing method thereof | Kun-Yung Huang, Jing CHENG, Bin-Hui Tseng | 2019-04-30 |
| 10177077 | Chip structure having redistribution layer | Ting-Feng Su | 2019-01-08 |