Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10249573 | Semiconductor device package with a stress relax pattern | Chia-Jen Chou | 2019-04-02 |
| 10177077 | Chip structure having redistribution layer | Chi-Liang Pan | 2019-01-08 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10249573 | Semiconductor device package with a stress relax pattern | Chia-Jen Chou | 2019-04-02 |
| 10177077 | Chip structure having redistribution layer | Chi-Liang Pan | 2019-01-08 |