Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347508 | Printed adhesion deposition to mitigate integrated circuit delamination | Yong Lin, Rongwei Zhang, Benjamin Stassen Cook | 2019-07-09 |
| 10284172 | Acoustic device package and method of making | Enis Tuncer | 2019-05-07 |
| 10199348 | Plastic-packaged semiconductor device having wires with polymerized insulating layer | Rongwei Zhang | 2019-02-05 |