Issued Patents 2019
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510846 | Semiconductor device with needle-shaped field plate structures in a transistor cell region and in an inner termination region | Ralf Siemieniec, Franz Hirler, Michael Hutzler, David Laforet, Cedric Ouvrard +1 more | 2019-12-17 |
| 10453931 | Semiconductor device having termination trench | Franz Hirler, Ralf Siemieniec, Li Juin Yip | 2019-10-22 |
| 10453929 | Methods of manufacturing a power MOSFET | David Laforet, Michael Hutzler, Cedric Ouvrard, Ralf Siemieniec, Li Juin Yip | 2019-10-22 |
| 10388782 | Scalable current sense transistor | Giuseppe Bernacchia, Riccardo Pittassi | 2019-08-20 |
| 10374078 | Semiconductor devices and a method for forming a semiconductor device | Britta Wutte | 2019-08-06 |
| 10355126 | Semiconductor devices and method for manufacturing semiconductor devices | — | 2019-07-16 |
| 10347491 | Forming recombination centers in a semiconductor device | Wolfgang Jantscher, Alexander Binter, Petra Fischer, Ravi Keshav Joshi, Kurt Pekoll +5 more | 2019-07-09 |
| 10249721 | Semiconductor device including a gate trench and a source trench | — | 2019-04-02 |
| 10199456 | Method of manufacturing a semiconductor device having a charge compensation region underneath a gate trench | Minghao Jin, Li Juin Yip, Martin Vielemeyer, Franz Hirler | 2019-02-05 |
| 10177250 | Method of manufacturing a semiconductor device with a metal-filled groove in a polysilicon gate electrode | Ralf Siemieniec, Li Juin Yip | 2019-01-08 |