Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510846 | Semiconductor device with needle-shaped field plate structures in a transistor cell region and in an inner termination region | Oliver Blank, Franz Hirler, Michael Hutzler, David Laforet, Cedric Ouvrard +1 more | 2019-12-17 |
| 10453929 | Methods of manufacturing a power MOSFET | David Laforet, Oliver Blank, Michael Hutzler, Cedric Ouvrard, Li Juin Yip | 2019-10-22 |
| 10453931 | Semiconductor device having termination trench | Oliver Blank, Franz Hirler, Li Juin Yip | 2019-10-22 |
| 10332876 | Method of forming compound semiconductor body | Daniel Kueck, Gilberto Curatola, Romain Esteve | 2019-06-25 |
| 10304953 | Semiconductor device with stripe-shaped trench gate structures, transistor mesas and diode mesas | Thomas Aichinger, Dethard Peters | 2019-05-28 |
| 10276670 | Semiconductor devices and methods for forming semiconductor devices | Li Juin Yip | 2019-04-30 |
| 10211306 | Semiconductor device with diode region and trench gate structure | Dethard Peters, Romain Esteve, Wolfgang Bergner, Thomas Aichinger, Daniel Kueck +4 more | 2019-02-19 |
| 10177250 | Method of manufacturing a semiconductor device with a metal-filled groove in a polysilicon gate electrode | Oliver Blank, Li Juin Yip | 2019-01-08 |