Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10283432 | Molded package with chip carrier comprising brazed electrically conductive layers | Mark Pavier, Wolfram Hable, Angela Kessler, Michael Sielaff, Anton Pugatschow +1 more | 2019-05-07 |