Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522478 | Semiconductor device with circumferential structure and method of manufacturing | Adolf Koller | 2019-12-31 |
| 10403506 | Separation of workpiece with three material removal stages | Christoph Kamseder, Andreas Bauer, Thomas Fischer | 2019-09-03 |
| 10373871 | Method of separating semiconductor dies from a semiconductor substrate, semiconductor substrate assembly and semiconductor die assembly | Markus Brunnbauer | 2019-08-06 |