Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10373871 | Method of separating semiconductor dies from a semiconductor substrate, semiconductor substrate assembly and semiconductor die assembly | Franco Mariani | 2019-08-06 |
MB
Markus Brunnbauer
Overall (2019): #365,573 of 560,194Top 70%
1
Patents 2019