Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475761 | Method for producing electronic device with multi-layer contact | Michael Juerss, Konrad Roesl, Oliver Eichinger, Kok Chai Goh, Tobias Schmidt | 2019-11-12 |
| 10262959 | Semiconductor devices and methods of forming thereof | Evelyn Napetschnig, Ulrike Fastner, Thomas Fischer | 2019-04-16 |
| 10192849 | Semiconductor modules with semiconductor dies bonded to a metal foil | Petteri Palm, Holger Torwesten, Tobias Simbeck | 2019-01-29 |