Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10192849 | Semiconductor modules with semiconductor dies bonded to a metal foil | Petteri Palm, Alexander Heinrich, Tobias Simbeck | 2019-01-29 |
HT
Holger Torwesten
Overall (2019): #441,529 of 560,194Top 80%
1
Patents 2019