NM

Neelima Mandloi

IBM: 1 patents #5,496 of 11,143Top 50%
📍 East Fishkill, NY: #1 of 1 inventorsTop 100%
🗺 New York: #5,008 of 13,137 inventorsTop 40%
Overall (2019): #329,890 of 560,194Top 60%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10254642 Modifying design layer of integrated circuit (IC) using nested and non-nested fill objects Veeresh V. Deshpande, Howard S. Landis, Arun Sankar Mampazhy 2019-04-09