Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10254642 | Modifying design layer of integrated circuit (IC) using nested and non-nested fill objects | Veeresh V. Deshpande, Howard S. Landis, Neelima Mandloi | 2019-04-09 |
AM
Arun Sankar Mampazhy
Overall (2019): #536,811 of 560,194Top 100%
1
Patents 2019