HL

Howard S. Landis

IBM: 1 patents #5,496 of 11,143Top 50%
📍 South Burlington, VT: #45 of 112 inventorsTop 45%
🗺 Vermont: #189 of 496 inventorsTop 40%
Overall (2019): #442,249 of 560,194Top 80%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10254642 Modifying design layer of integrated circuit (IC) using nested and non-nested fill objects Veeresh V. Deshpande, Arun Sankar Mampazhy, Neelima Mandloi 2019-04-09