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Hongwen Yan

IBM: 2 patents #3,235 of 11,143Top 30%
📍 Somers, NY: #20 of 53 inventorsTop 40%
🗺 New York: #2,767 of 13,137 inventorsTop 25%
Overall (2019): #166,081 of 560,194Top 30%
2
Patents 2019

Issued Patents 2019

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10366918 Self-aligned trench metal-alloying for III-V nFETs Kevin K. Chan, Sebastian U. Engelmann, Marinus Hopstaken, Christopher Scerbo, Yu Zhu 2019-07-30
10276384 Plasma shallow doping and wet removal of depth control cap Robert L. Bruce, Kevin K. Chan, Sebastian U. Engelmann, Dario L. Goldfarb, Marinus Hopstaken +3 more 2019-04-30