Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418277 | Air gap spacer formation for nano-scale semiconductor devices | Kangguo Cheng, Thomas J. Haigh, Jr., Juntao Li, Sanjay C. Mehta, Son V. Nguyen +2 more | 2019-09-17 |
| 10309884 | Predicting semiconductor package warpage | Stephen P. Ayotte, Travis S. Longenbach | 2019-06-04 |