Issued Patents 2019
Showing 1–25 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10500859 | Molded die slivers with exposed front and back surfaces | Chien-Hua Chen | 2019-12-10 |
| 10493766 | Fluid level sensing with protective member | Chien-Hua Chen, Devin Alexander Mourey | 2019-12-03 |
| 10479085 | Printhead electrical interconnects | Devin Alexander Mourey, Chien-Hua Chen | 2019-11-19 |
| 10471714 | Printhead | Chien-Hua Chen | 2019-11-12 |
| 10464324 | Molded fluid flow structure | Chien-Hua Chen | 2019-11-05 |
| 10434774 | Fluid ejection die and glass-based support substrate | Chien-Hua Chen | 2019-10-08 |
| 10438864 | Circuit packages comprising epoxy mold compounds and methods of compression molding | Chien-Hua Chen, Stephen Farrar | 2019-10-08 |
| 10434770 | Printing element temperature adjustment | Garrett E. Clark, Mark H. MacKenzie, Jose Luis Valero | 2019-10-08 |
| 10427407 | Printer circuit board fluid ejection apparatus | Chien-Hua Chen, Devin Alexander Mourey | 2019-10-01 |
| 10427406 | Print bar sensors | Garrett E. Clark, Jeremy Sells, Mark H. MacKenzie | 2019-10-01 |
| 10421278 | Fluid ejection die and plastic-based substrate | Chien-Hua Chen, Devin Alexander Mourey | 2019-09-24 |
| 10421279 | Molded printhead | Chien-Hua Chen | 2019-09-24 |
| 10421274 | Printbars and methods of forming printbars | Chien-Hua Chen | 2019-09-24 |
| 10384450 | Inkjet printhead | Chien-Hua Chen, Diane R. Hammerstad | 2019-08-20 |
| D857230 | Cassette | Gary G. Lutnesky | 2019-08-20 |
| 10377142 | Overmolded ink delivery device | Chien-Hua Chen, Devin Alexander Mourey | 2019-08-13 |
| 10369793 | Service structures in print heads | Devin Alexander Mourey, Chien-Hua Chen | 2019-08-06 |
| 10363745 | Printheads with pressure equalization | Garrett E. Clark, Mark H. MacKenzie | 2019-07-30 |
| 10343397 | Printer cartridge with multiple fluid chambers in fluid communication | Mark H. MacKenzie, Garrett E. Clark | 2019-07-09 |
| 10342140 | Printed circuit board to molded compound interface | Chien-Hua Chen, Gary G. Lutnesky, Eric L. Nikkel | 2019-07-02 |
| 10319657 | Circuit package having a plurality of epoxy mold compounds with different compositions | Chien-Hua Chen | 2019-06-11 |
| 10300701 | Printed circuit board fluid ejection apparatus | Chien-Hua Chen | 2019-05-28 |
| 10300691 | Wide array printhead module | Peter Fricke, Scott A. Linn | 2019-05-28 |
| 10272680 | Fluid ejection device | Chien-Hua Chen, Gary G. Lutnesky | 2019-04-30 |
| 10276468 | Circuit package | Chien-Hua Chen, Stephen Farrar | 2019-04-30 |