Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10342140 | Printed circuit board to molded compound interface | Chien-Hua Chen, Gary G. Lutnesky, Michael W. Cumbie | 2019-07-02 |
| 10195852 | Printhead assembly | Silam J. Choy, Devin Alexander Mourey | 2019-02-05 |