Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10438864 | Circuit packages comprising epoxy mold compounds and methods of compression molding | Chien-Hua Chen, Michael W. Cumbie | 2019-10-08 |
| 10276468 | Circuit package | Chien-Hua Chen, Michael W. Cumbie | 2019-04-30 |