Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418267 | Method of processing a semiconductor wafer, semiconductor chip, and surface protective tape | Yoshifumi OKA | 2019-09-17 |
| 10196534 | Resin composition for sealing electronic device, and electronic device | Takumi Asanuma, Yasushi Ishizaka, Tetsuya Mieda | 2019-02-05 |
| 10196547 | Resin composition for sealing electronic device, and electronic device | Takumi Asanuma, Yasushi Ishizaka | 2019-02-05 |